3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019
This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019.
Browse Complete report with TOC : www.marketresearchreports.biz/analysis-details/3d-ics-mems-and-sensors-rf-sip-optoelectronics-and-imaging-memories-logic-hb-led-market-global-industry-analysis-size-share-growth-trends-and-forecast-2013-2019
The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred. This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter’s five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments.
Apart from the detailed sub-segment analysis as mentioned below, this report also provides company profiles of key market players. The competitive profiling of these players includes company and financial overview, business strategies adopted by them, and their recent developments which can help in assessing competition in the market. Major companies included in this report are Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Xilinx Inc., 3M Company, Micron Technology Inc., (Elpida Memory Inc.), Ziptronix, Inc., Tezzaron Semiconductor Corporation, MonolithIC 3D Inc., STATS ChipPAC Ltd. and United Microelectronics Corporation (UMC).
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This report analyzes the global 3D ICs market in terms of revenue (USD million). The market has been segmented as follows:
3D ICs Market, By End-Use Sectors:
• Consumer electronics
• Information and communication technology
• Transport (automotive and aerospace)
• Military
• Others(Biomedical applications and R&D)
3D ICs Market, By Substrate Type:
• Silicon on insulator(SOI)
• Bulk Silicon
3D ICs Market, By Fabrication Process:
• Beam re-crystallization
• Wafer bonding
• Silicon epitaxial growth
• Solid phase crystallization
3D ICs Market, By Product:
• MEMS and Sensor
• RF SiP
• Optoelectronics and imaging
• Memories (3D Stacks)
• Logic (3D Sip/Soc)
• HB LED
3D ICs Market, By Geography:
• North America
• Europe
• Asia Pacific
• Rest of World (RoW)
Table of content
Chapter 1 Preface
1.1 Report description and scope
1.1.1 Market segmentation
1.2 Research methodology
Chapter 2 Executive Summary
2.1 Global 3D ICs market snapshot, 2012 & 2019
2.2 Global 3D ICs market, 2011 – 2019 (USD million)
Buy A copy Of This Report: http://www.marketresearchreports.biz/analysis/185672
Chapter 3 3D ICs Market Overview
3.1 Introduction
3.2 Market dynamics
3.2.1 Drivers
3.2.1.1 Growing demand for efficient solutions
3.2.1.2 Rise in number of portable devices
3.2.2 Restraints
3.2.2.1 High cost, thermal and testing issues
3.2.3 Opportunities
3.2.3.1 Big Data and predictive analytics
3.3 Trends and future outlook
3.3.1 Multi-chip packaging
3.3.2 IntSim
3.4 Value chain analysis
3.4.1 Inbound logistics
3.4.2 Operations
3.4.3 Out-bound logistics
3.4.4 Marketing, sales and services
3.5 Porter’s five forces analysis
3.5.1 Bargaining power of suppliers
3.5.2 Bargaining power of buyers
3.5.3 Threat of substitutes
3.5.4 Threat of new entrants
3.5.5 Degree of competition
3.6 Technology overview
3.6.1 Shift to 3D IC from 2.5D IC technology
3.6.2 3D IC fabrication processes
3.6.3 Standards issues at different levels of 3D IC production
3.6.4 Patent filings
3.7 Market attractiveness analysis
3.8 Competitive analysis
3.8.1 Market share of key players, 2012 (%)
Chapter 4 Global 3D ICs Market, by End-Use Industry
4.1 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
4.2 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
4.3 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
4.4 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
4.5 Military 3D ICs market, 2011 – 2019 (USD million)
4.6 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)
Chapter 5 Global 3D ICs Market, by Substrate Type
5.1 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
5.2 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
5.3 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)
Chapter 6 Global 3D ICs Market, by Fabrication Process
6.1 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
6.2 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
6.3 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
6.4 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
6.5 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)
Chapter 7 Global 3D ICs Market, by Product
7.1 Global 3D ICs market overview, by product, 2012 & 2019 (%)
7.2 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
7.3 RF SiP 3D ICs market, 2011 – 2019 (USD million)
7.4 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
7.5 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
7.6 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
7.7 HB LED 3D ICs market, 2011 – 2019 (USD million)
Chapter 8 Global 3D ICs Market, by Geography
8.1 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
8.2 North America 3D ICs market, 2011 – 2019 (USD million)
8.3 Europe 3D ICs market, 2011 – 2019 (USD million)
8.4 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
8.5 RoW 3D ICs market, 2011 – 2019 (USD million)
Chapter 9 Company Profiles
Contact US:
Office: United States
State Tower
90 State Street, Suite 700
Albany, NY 12207
Tel: +1-518-618-1030
E: sales@marketresearchreports.biz
Blog: http://mresearchreports.blogspot.com/
This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019.
Browse Complete report with TOC : www.marketresearchreports.biz/analysis-details/3d-ics-mems-and-sensors-rf-sip-optoelectronics-and-imaging-memories-logic-hb-led-market-global-industry-analysis-size-share-growth-trends-and-forecast-2013-2019
The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred. This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter’s five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments.
Apart from the detailed sub-segment analysis as mentioned below, this report also provides company profiles of key market players. The competitive profiling of these players includes company and financial overview, business strategies adopted by them, and their recent developments which can help in assessing competition in the market. Major companies included in this report are Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Xilinx Inc., 3M Company, Micron Technology Inc., (Elpida Memory Inc.), Ziptronix, Inc., Tezzaron Semiconductor Corporation, MonolithIC 3D Inc., STATS ChipPAC Ltd. and United Microelectronics Corporation (UMC).
To Download Sample Report Visit @ http://www.marketresearchreports.biz/sample/sample/185672
This report analyzes the global 3D ICs market in terms of revenue (USD million). The market has been segmented as follows:
3D ICs Market, By End-Use Sectors:
• Consumer electronics
• Information and communication technology
• Transport (automotive and aerospace)
• Military
• Others(Biomedical applications and R&D)
3D ICs Market, By Substrate Type:
• Silicon on insulator(SOI)
• Bulk Silicon
3D ICs Market, By Fabrication Process:
• Beam re-crystallization
• Wafer bonding
• Silicon epitaxial growth
• Solid phase crystallization
3D ICs Market, By Product:
• MEMS and Sensor
• RF SiP
• Optoelectronics and imaging
• Memories (3D Stacks)
• Logic (3D Sip/Soc)
• HB LED
3D ICs Market, By Geography:
• North America
• Europe
• Asia Pacific
• Rest of World (RoW)
Table of content
Chapter 1 Preface
1.1 Report description and scope
1.1.1 Market segmentation
1.2 Research methodology
Chapter 2 Executive Summary
2.1 Global 3D ICs market snapshot, 2012 & 2019
2.2 Global 3D ICs market, 2011 – 2019 (USD million)
Buy A copy Of This Report: http://www.marketresearchreports.biz/analysis/185672
Chapter 3 3D ICs Market Overview
3.1 Introduction
3.2 Market dynamics
3.2.1 Drivers
3.2.1.1 Growing demand for efficient solutions
3.2.1.2 Rise in number of portable devices
3.2.2 Restraints
3.2.2.1 High cost, thermal and testing issues
3.2.3 Opportunities
3.2.3.1 Big Data and predictive analytics
3.3 Trends and future outlook
3.3.1 Multi-chip packaging
3.3.2 IntSim
3.4 Value chain analysis
3.4.1 Inbound logistics
3.4.2 Operations
3.4.3 Out-bound logistics
3.4.4 Marketing, sales and services
3.5 Porter’s five forces analysis
3.5.1 Bargaining power of suppliers
3.5.2 Bargaining power of buyers
3.5.3 Threat of substitutes
3.5.4 Threat of new entrants
3.5.5 Degree of competition
3.6 Technology overview
3.6.1 Shift to 3D IC from 2.5D IC technology
3.6.2 3D IC fabrication processes
3.6.3 Standards issues at different levels of 3D IC production
3.6.4 Patent filings
3.7 Market attractiveness analysis
3.8 Competitive analysis
3.8.1 Market share of key players, 2012 (%)
Chapter 4 Global 3D ICs Market, by End-Use Industry
4.1 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
4.2 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
4.3 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
4.4 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
4.5 Military 3D ICs market, 2011 – 2019 (USD million)
4.6 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)
Chapter 5 Global 3D ICs Market, by Substrate Type
5.1 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
5.2 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
5.3 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)
Chapter 6 Global 3D ICs Market, by Fabrication Process
6.1 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
6.2 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
6.3 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
6.4 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
6.5 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)
Chapter 7 Global 3D ICs Market, by Product
7.1 Global 3D ICs market overview, by product, 2012 & 2019 (%)
7.2 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
7.3 RF SiP 3D ICs market, 2011 – 2019 (USD million)
7.4 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
7.5 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
7.6 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
7.7 HB LED 3D ICs market, 2011 – 2019 (USD million)
Chapter 8 Global 3D ICs Market, by Geography
8.1 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
8.2 North America 3D ICs market, 2011 – 2019 (USD million)
8.3 Europe 3D ICs market, 2011 – 2019 (USD million)
8.4 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
8.5 RoW 3D ICs market, 2011 – 2019 (USD million)
Chapter 9 Company Profiles
Contact US:
Office: United States
State Tower
90 State Street, Suite 700
Albany, NY 12207
Tel: +1-518-618-1030
E: sales@marketresearchreports.biz
Blog: http://mresearchreports.blogspot.com/
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